facebook twitter linked-in
Active & Intelligent Packaging Industry Association

AIPIA
  • News
  • Congress & Exhibition
  • Subscribers & Partners
  • Alliance
  • Online Course
  • Press
  • Contact
  1. You are here:
  2. AIPIA
  3. News
  • Newsletter Sign Up

Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

iPak AG
CIT Technology Ltd.
University College Cork
Lamipak
RH Smith & Sons (Wigmakers) LTD
CURTI SpA
Brandimation
KONCEPT-L.S.A.
Motif
Hana RFID
Cyntra Labs
Secure Ink Technology
Veritrace
AVA packaging solutions Ltd.
SUN Automation Group
Fraunhofer Institute for Microelectronic Circuits and Systems IMS
KISICO
Packaging Bull UK
AIMPLAS
NEFTAG
3M
RAKO-GROUP
Chip2Foil
Kelappaji College of Agricultural Engineering & Food Technology, Tavanur
HKSCAN
Tracked Assets
DNP Imagingcomm Europe BV
Merrill's Packaging
American Packaging Corporation

Vyoma Software, Inc.



Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

iPak AG
CIT Technology Ltd.
University College Cork
Lamipak
RH Smith & Sons (Wigmakers) LTD
CURTI SpA
Brandimation
KONCEPT-L.S.A.
Motif
Hana RFID
Cyntra Labs
Secure Ink Technology
Veritrace
AVA packaging solutions Ltd.
SUN Automation Group
Fraunhofer Institute for Microelectronic Circuits and Systems IMS
KISICO
Packaging Bull UK
AIMPLAS
NEFTAG
3M
RAKO-GROUP
Chip2Foil
Kelappaji College of Agricultural Engineering & Food Technology, Tavanur
HKSCAN
Tracked Assets
DNP Imagingcomm Europe BV
Merrill's Packaging
American Packaging Corporation

Vyoma Software, Inc.

AIPIA
AWA Conferences & Events
Koningin Wilhelminaplein 13
Tower 1, Floor 10, Unit 12

1062 HH  Amsterdam
The Netherlands

Congress & Exhibition

Program
Register here
Apply as speaker
Apply for standspace

Members & Partners

Our members & partners
Apply as member/partner
 

Press

Press Releases
Press Department

AIPIA Community

AIPIA Community
AIPIA Connect Members
 

Contact

Stay in contact
Route
© copyright 2026: aipia.info | Privacy Statement & Disclaimer | Sitemap | Halinta frontend by Huis-stijl