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Active & Intelligent Packaging Industry Association

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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

University of Illinois
Evonik GmbH
Biotipac
PragmatIC Semiconductor Ltd
FINAT
RELIEVES EGARA
Select Ink
Techind Engineers & Consultants-Impex.
Università degli Studi di Torino - DISAFA
Boegli-Gravures SA
Plastics Color Corporation
Recology of San Francisco
INEXTO SA
Hive Connect
Cedap
Nestle
KISICO
KU Leuven L-itL University of Leuven
Toyo Ink Co Ltd
Barenbrug Holland bv
Masterpress S.A.
DigiPlan TEC Inc.
SELP
StealthCode
Proactive Packaging & Display
German Institute of Food Technologies (DIL e.V.)

Mimica

All4Labels Global Packaging Group
ProData GmbH
Pulse Flexibles Ltd


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

University of Illinois
Evonik GmbH
Biotipac
PragmatIC Semiconductor Ltd
FINAT
RELIEVES EGARA
Select Ink
Techind Engineers & Consultants-Impex.
Università degli Studi di Torino - DISAFA
Boegli-Gravures SA
Plastics Color Corporation
Recology of San Francisco
INEXTO SA
Hive Connect
Cedap
Nestle
KISICO
KU Leuven L-itL University of Leuven
Toyo Ink Co Ltd
Barenbrug Holland bv
Masterpress S.A.
DigiPlan TEC Inc.
SELP
StealthCode
Proactive Packaging & Display
German Institute of Food Technologies (DIL e.V.)

Mimica

All4Labels Global Packaging Group
ProData GmbH
Pulse Flexibles Ltd
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